Invention Grant
- Patent Title: High electron mobility transistors and methods of manufacturing the same
- Patent Title (中): 高电子迁移率晶体管及其制造方法
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Application No.: US13307769Application Date: 2011-11-30
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Publication No.: US08796737B2Publication Date: 2014-08-05
- Inventor: In-jun Hwang , Jai-kwang Shin , Jae-joon Oh , Jong-bong Ha , Hyuk-soon Choi , Ki-ha Hong
- Applicant: In-jun Hwang , Jai-kwang Shin , Jae-joon Oh , Jong-bong Ha , Hyuk-soon Choi , Ki-ha Hong
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0043082 20110506
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/338

Abstract:
High electron mobility transistors (HEMTs) and methods of manufacturing the same. A HEMT may include a channel layer and a channel supply layer, and the channel supply layer may be a multilayer structure. The channel supply layer may include an etch stop layer and an upper layer on the etch stop layer. A recess region may be in the upper layer. The recess region may be a region recessed to an interface between the upper layer and the etch stop layer. A gate electrode may be on the recess region.
Public/Granted literature
- US20120280244A1 High Electron Mobility Transistors And Methods Of Manufacturing The Same Public/Granted day:2012-11-08
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