Invention Grant
- Patent Title: Nonvolatile semiconductor device and method of manufacturing the same
- Patent Title (中): 非易失性半导体器件及其制造方法
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Application No.: US13755348Application Date: 2013-01-31
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Publication No.: US08796756B2Publication Date: 2014-08-05
- Inventor: Kenichi Akita , Daisuke Okada , Keisuke Kuwahara , Yasafumi Morimoto , Yasuhiro Shimamoto , Kan Yasui , Tsuyoshi Arigane , Tetsuya Ishimaru
- Applicant: Kenichi Akita , Daisuke Okada , Keisuke Kuwahara , Yasafumi Morimoto , Yasuhiro Shimamoto , Kan Yasui , Tsuyoshi Arigane , Tetsuya Ishimaru
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2007-218147 20070824
- Main IPC: H01L29/792
- IPC: H01L29/792

Abstract:
A charge storage layer interposed between a memory gate electrode and a semiconductor substrate is formed shorter than a gate length of the memory gate electrode or a length of insulating films so as to make the overlapping amount of the charge storage layer and a source region to be less than 40 nm. Therefore, in the write state, since the movement in the transverse direction of the electrons and the holes locally existing in the charge storage layer decreases, the variation of the threshold voltage when holding a high temperature can be reduced. In addition, the effective channel length is made to be 30 nm or less so as to reduce an apparent amount of holes so that coupling of the electrons with the holes in the charge storage layer decreases; therefore, the variation of the threshold voltage when holding at room temperature can be reduced.
Public/Granted literature
- US20130140622A1 NONVOLATILE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-06-06
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