Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12572646Application Date: 2009-10-02
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Publication No.: US08796780B2Publication Date: 2014-08-05
- Inventor: Yoshiki Yamamoto , Yukio Nishida , Jiro Yugami
- Applicant: Yoshiki Yamamoto , Yukio Nishida , Jiro Yugami
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-275097 20081027
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
Provided is a semiconductor device capable of having a single metal/dual high-k structure with a good shape and having flat band voltages suited for nMOS and pMOS, respectively. The semiconductor device according to the one embodiment of the present invention has a first conductivity type MOSFET and a second conductivity type MOSFET. The first and second conductivity type MOSFETs are each equipped with a first insulating film formed over a semiconductor substrate, a second insulating film formed over the first insulating film and made of an insulating material having a higher dielectric constant than the first insulating film, and a gate electrode formed over the second insulating film and having, as a lower layer of the gate electrode, a metal layer containing a material which diffuses into the second insulating film to control a work function thereof. The second conductivity type MOSFET is equipped further with a diffusion barrier film formed between the first insulating film and the second insulating film to prevent diffusion of a work-function controlling material into the interface of the first insulating film.
Public/Granted literature
- US20100102395A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-04-29
Information query
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