Invention Grant
- Patent Title: Imaging module, fabricating method therefor, and imaging device
- Patent Title (中): 成像模块,其制造方法和成像装置
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Application No.: US13007846Application Date: 2011-01-17
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Publication No.: US08796798B2Publication Date: 2014-08-05
- Inventor: Daiki Minegishi , Yasuhiro Satoh , Eiji Mochizuki , Masayuki Fujishima , Hiroshi Miura
- Applicant: Daiki Minegishi , Yasuhiro Satoh , Eiji Mochizuki , Masayuki Fujishima , Hiroshi Miura
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2010-015280 20100127
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146

Abstract:
An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.
Public/Granted literature
- US20110180893A1 IMAGING MODULE, FABRICATING METHOD THEREFOR, AND IMAGING DEVICE Public/Granted day:2011-07-28
Information query
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