Invention Grant
- Patent Title: Semiconductor module with electrical switching elements
- Patent Title (中): 具有电气开关元件的半导体模块
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Application No.: US13086620Application Date: 2011-04-14
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Publication No.: US08796816B2Publication Date: 2014-08-05
- Inventor: Yuji Hayashi , Yuuichi Handa
- Applicant: Yuji Hayashi , Yuuichi Handa
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2010-092744 20100414; JP2011-085974 20110408
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A semiconductor module is provided which is capable of lowering surges caused when switching elements are switched on and off. The module has a plurality of lead frames, switching elements, electronic components, and a sealing member. The switching elements are electrically connected to the lead frames respectively. Part of the lead frames, the switching elements, and the electronic components are sealed by the sealing member. The electronic components are mounted on primary surfaces of the lead frames respectively.
Public/Granted literature
- US20110291236A1 SEMICONDUCTOR MODULE WITH ELECTRICAL SWITCHING ELEMENTS Public/Granted day:2011-12-01
Information query
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