Invention Grant
US08796865B1 RFID tags with bumped substrate, and apparatuses and methods for making
有权
具有凸起基板的RFID标签，以及用于制造的装置和方法
- Patent Title: RFID tags with bumped substrate, and apparatuses and methods for making
- Patent Title (中): 具有凸起基板的RFID标签，以及用于制造的装置和方法
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Application No.: US14083244Application Date: 2013-11-18
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Publication No.: US08796865B1Publication Date: 2014-08-05
- Inventor: Jay M. Fassett , Ronald A. Oliver , Ronald L. Koepp , Steven I. Mozsgai , Ernest Allen, III
- Applicant: Impinj, Inc.
- Applicant Address: US WA Seattle
- Assignee: Impinj, Inc.
- Current Assignee: Impinj, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Turk IP Law, LLC
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.
Information query
IPC分类:
