Invention Grant
- Patent Title: AC, RF or pulse excited microdischarge device and array
- Patent Title (中): AC,RF或脉冲激发微放电器件和阵列
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Application No.: US11899083Application Date: 2007-09-04
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Publication No.: US08796926B2Publication Date: 2014-08-05
- Inventor: J. Gary Eden , Ju Gao , Sung-o Kim
- Applicant: J. Gary Eden , Ju Gao , Sung-o Kim
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of the University of Illinois
- Current Assignee: The Board of Trustees of the University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Greer, Burns & Crain, Ltd.
- Main IPC: H01J17/49
- IPC: H01J17/49 ; H01J17/04

Abstract:
An AC, rf, or pulse-excited microdischarge device and array are provide by the invention. A preferred array includes a substrate. A plurality of microdischarge cavities that contain discharge medium are in the substrate. A transparent layer seals the discharge medium in the microdischarge cavites. Electrodes stimulate the discharge medium. The microdischarge cavities are physically isolated from the electrodes by dielectric and arranged relative to the electrodes such that ac, rf, or pulsed excitation applied to the electrodes stimulates plasma excitation of the discharge medium. The microdischarge cavities are sized to produce plasma within the microdischarge cavities.
Public/Granted literature
- US20090128031A1 AC, RF or pulse excited microdischarge device and array Public/Granted day:2009-05-21
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