Invention Grant
- Patent Title: Multilayer ceramic electronic part and method of manufacturing the same
- Patent Title (中): 多层陶瓷电子零件及其制造方法
-
Application No.: US13670037Application Date: 2012-11-06
-
Publication No.: US08797709B2Publication Date: 2014-08-05
- Inventor: Hae Suk Chung , Min Cheol Park , Hyung Joon Kim , Byoung Hwa Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0118191 20111114
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/228

Abstract:
There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm.
Public/Granted literature
- US20130120899A1 MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-05-16
Information query