Invention Grant
- Patent Title: Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member
- Patent Title (中): 热源元件和导热构件的固定结构，以及固定热源元件和导热构件的方法
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Application No.: US13298894Application Date: 2011-11-17
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Publication No.: US08797743B2Publication Date: 2014-08-05
- Inventor: Yoichiro Taka , Masashi Takano , Tarou Aikawa
- Applicant: Yoichiro Taka , Masashi Takano , Tarou Aikawa
- Applicant Address: JP Anjo
- Assignee: Aisin Aw Co., Ltd.
- Current Assignee: Aisin Aw Co., Ltd.
- Current Assignee Address: JP Anjo
- Agency: Oliff PLC
- Priority: JP2010-268838 20101201
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An electronic device mounted on a circuit board and accommodated in a housing includes a heat source element accommodated in the housing and mounted on the circuit board, and a heat conducting member accommodated in the housing. The heat conducting member is movably mounted on the circuit board. An elastic member fixes the heat source element and the heat conducting member in abutment with each other. The elasticity of the elastic member permits variations in the relative positions of the heat source element and the heat conducting member while maintaining the abutment of the heat source element and the heat conducting member.
Public/Granted literature
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