Invention Grant
- Patent Title: Metal sheet structure and electronic device
- Patent Title (中): 金属板结构和电子设备
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Application No.: US13445456Application Date: 2012-04-12
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Publication No.: US08797750B2Publication Date: 2014-08-05
- Inventor: Hideki Maeda , Akira Shimasaki
- Applicant: Hideki Maeda , Akira Shimasaki
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K9/00 ; H05K7/18 ; H05K5/02 ; H05K7/14 ; G06F1/18
Abstract:
A first metal sheet and a second metal sheet are arranged opposite a printed circuit board including a second connector that fits into a first connector that is arranged at one end of a cable. A hole section through which the first connector passes is arranged in each of the first metal sheet and the second metal sheet. The first connector fits into the second connector by passing through each of the hole sections of the first metal sheet and the second metal sheet. The first metal sheet and the second metal sheet support a connector case of the first connector, thus improving the load bearing characteristics of the cable connection.
Public/Granted literature
- US20120195012A1 METAL SHEET STRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2012-08-02
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