An electronic module with excellent electrical characteristics includes an electronic component, a mount board, signal electrodes, a ground electrode, and an insulating layer. The electronic component is mounted on a first main surface of the mount board. The signal electrodes and the ground electrode are located on a second main surface of the mount board. The insulating layer is arranged so as to cover a portion of the second main surface of the mount board. The insulating layer is arranged so as not to cover end portions of the signal electrodes that face the ground electrode.