Invention Grant
- Patent Title: Substrate, electronic device, and electronic apparatus
- Patent Title (中): 基板,电子设备和电子设备
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Application No.: US13560039Application Date: 2012-07-27
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Publication No.: US08797760B2Publication Date: 2014-08-05
- Inventor: Kenji Sato
- Applicant: Kenji Sato
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-168570 20110801
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A substrate includes: a base; and a plurality of bonding terminals arranged on at least one surface of the base, wherein the plurality of bonding terminals include a first bonding terminal and a second bonding terminal, the first bonding terminal and the second bonding terminal include, in plan view of the base, a circle contacting portion extending along the circumference of a circle tangent to the first bonding terminal and the second bonding terminal, all of the plurality of bonding terminals are arranged so as not to protrude from an area including the circle and the inside thereof, and the circle contacting portion includes at least a first circle contacting portion disposed in the first bonding terminal and a second circle contacting portion disposed in the second bonding terminal.
Public/Granted literature
- US20130033838A1 SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2013-02-07
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