Invention Grant
- Patent Title: Displacement sensor with reduced hysteresis
- Patent Title (中): 位移传感器滞后减小
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Application No.: US13453849Application Date: 2012-04-23
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Publication No.: US08800155B2Publication Date: 2014-08-12
- Inventor: Jack A. Ekchian
- Applicant: Jack A. Ekchian
- Main IPC: G01C9/06
- IPC: G01C9/06

Abstract:
A method and apparatus are provided for reducing hysteresis in displacement sensors by reducing the resistance to motion between components in the sensing units that move relative to each other.
Public/Granted literature
- US20120266470A1 Displacement Sensor with Reduced Hysteresis Public/Granted day:2012-10-25
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