Invention Grant
- Patent Title: Heat dissipation apparatus with heat pipe
- Patent Title (中): 散热装置带热管
-
Application No.: US13271162Application Date: 2011-10-11
-
Publication No.: US08800639B2Publication Date: 2014-08-12
- Inventor: Chun-Chi Chen , Xing-Hua He
- Applicant: Chun-Chi Chen , Xing-Hua He
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110254570 20110831
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20

Abstract:
An exemplary heat dissipation apparatus includes a number of fins and a heat pipe. Each fin defines a through hole therein. A collar extends from each fin at an edge of the through hole. The collar inclines toward a center of the through hole. An inner diameter of the collar gradually decreases along a direction away form the fin. A diameter of the heat pipe is larger than a minimum inner diameter of the collar when the collar in a natural state. When the heat pipe extends through the through hole of the fin, the collar is pushed by the heat pipe to expand outwardly, so that the heat pipe intimately contacts an inner face of the collar.
Public/Granted literature
- US20130048244A1 HEAT DISSIPATION APPARATUS WITH HEAT PIPE Public/Granted day:2013-02-28
Information query