Invention Grant
- Patent Title: Supporting apparatus for electronic device
- Patent Title (中): 电子设备配套设备
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Application No.: US13528026Application Date: 2012-06-20
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Publication No.: US08800942B2Publication Date: 2014-08-12
- Inventor: Wen-Hua Yu
- Applicant: Wen-Hua Yu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110422951 20111216
- Main IPC: F16M11/00
- IPC: F16M11/00 ; F16M11/14 ; F16M11/10 ; F16M11/12 ; F16M11/20
Abstract:
A supporting apparatus for an electronic device includes a ball joint and a holding mechanism for holding the electronic device. The electronic device is secured in the holding mechanism by spring pressure and is capable of being stably held in different orientations.
Public/Granted literature
- US20130153721A1 SUPPORTING APPARATUS FOR ELECTRONIC DEVICE Public/Granted day:2013-06-20
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