Invention Grant
- Patent Title: Bumper structure of cleaning robot
- Patent Title (中): 清洁机器人的保险杠结构
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Application No.: US13317412Application Date: 2011-10-18
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Publication No.: US08801057B2Publication Date: 2014-08-12
- Inventor: Jeong Hun Kim , Yong Jae Kim , Youn Baek Lee , Heum Yong Park , Kyung Shik Roh , Young Do Kwon
- Applicant: Jeong Hun Kim , Yong Jae Kim , Youn Baek Lee , Heum Yong Park , Kyung Shik Roh , Young Do Kwon
- Applicant Address: KR Suwon
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: Staas & Halsey LLP
- Priority: KR10-2010-0105097 20101027
- Main IPC: B60R19/00
- IPC: B60R19/00 ; B60R21/0136

Abstract:
A bumper structure of a cleaning robot which detects whether or not an obstacle contacts a bumper and a position of the obstacle, allows the bumper to be simply process and reduces the number of components of the cleaning robot to lower the production costs of the cleaning robot. The bumper structure includes a main body, a bumper installed on the front surface of the main body, a resistance film provided between the main body and the bumper and fixed to the main body, and a metal film provided between the main body and the bumper and fixed to the bumper such that the shape of the metal film is deformed together with the bumper and the metal film comes into contact with the resistance film when at least one obstacle contacts the bumper, so as to measure resistance values.
Public/Granted literature
- US20120126837A1 Bumper structure of cleaning robot Public/Granted day:2012-05-24
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