Invention Grant
- Patent Title: Module socket
- Patent Title (中): 模块插座
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Application No.: US13451747Application Date: 2012-04-20
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Publication No.: US08801439B2Publication Date: 2014-08-12
- Inventor: Eriko Sato , Toshihiro Niitsu , Hirokazu Suzuki , Akihiro Tezuka , Hideo Nagasawa
- Applicant: Eriko Sato , Toshihiro Niitsu , Hirokazu Suzuki , Akihiro Tezuka , Hideo Nagasawa
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- Priority: JP2011-093570 20110420
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K7/10 ; H01R13/193

Abstract:
The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.
Public/Granted literature
- US20120295484A1 MODULE SOCKET Public/Granted day:2012-11-22
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