Invention Grant
US08801844B2 Autocatalytic plating bath composition for deposition of tin and tin alloys
有权
用于沉积锡和锡合金的自动电镀浴组合物
- Patent Title: Autocatalytic plating bath composition for deposition of tin and tin alloys
- Patent Title (中): 用于沉积锡和锡合金的自动电镀浴组合物
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Application No.: US13996551Application Date: 2012-01-11
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Publication No.: US08801844B2Publication Date: 2014-08-12
- Inventor: Arnd Kilian , Jens Wegricht , Isabel-Roda Hirsekorn
- Applicant: Arnd Kilian , Jens Wegricht , Isabel-Roda Hirsekorn
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP11152524 20110128
- International Application: PCT/EP2012/050349 WO 20120111
- International Announcement: WO2012/100982 WO 20120802
- Main IPC: C23C18/52
- IPC: C23C18/52 ; C09D1/00 ; C23C18/31
Abstract:
An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
Public/Granted literature
- US20130309404A1 AUTOCATALYTIC PLATING BATH COMPOSITION FOR DEPOSITION OF TIN AND TIN ALLOYS Public/Granted day:2013-11-21
Information query
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