There is provided a substrate warpage removal apparatus and method which can remove warpage of a substrate which has a patterned surface having a film with a pattern, and a non-patterned surface having a film without a pattern. The substrate warpage removal apparatus includes: a holding plate configured to hold a substrate; a processing liquid supply pipe, provided on the side of the non-patterned surface of the substrate, configured to supply an etching liquid to the surface to remove a surface film; and a first laser displacement meter and a second laser displacement meter configured to detect warpage of the substrate. When the controller, based on signals from the first laser displacement meter and the second laser displacement meter, determines that warpage of the substrate has been eliminated, the controller stops the supply of an etching liquid from the processing liquid supply pipe.