Invention Grant
US08801893B2 Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor
有权
在电容耦合等离子体反应器中以均匀的温度冷却晶片载体的方法
- Patent Title: Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor
- Patent Title (中): 在电容耦合等离子体反应器中以均匀的温度冷却晶片载体的方法
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Application No.: US12855680Application Date: 2010-08-12
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Publication No.: US08801893B2Publication Date: 2014-08-12
- Inventor: Paul Lukas Brillhart , Richard Fovell , Douglas A. Buchberger, Jr. , Douglas H. Burns , Kallol Bera , Daniel J. Hoffman , Kenneth W. Cowans , William W. Cowans , Glenn W. Zubillaga , Isaac Millan
- Applicant: Paul Lukas Brillhart , Richard Fovell , Douglas A. Buchberger, Jr. , Douglas H. Burns , Kallol Bera , Daniel J. Hoffman , Kenneth W. Cowans , William W. Cowans , Glenn W. Zubillaga , Isaac Millan
- Applicant Address: US FL Wellington
- Assignee: BE Aerospace, Inc.
- Current Assignee: BE Aerospace, Inc.
- Current Assignee Address: US FL Wellington
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306 ; C23C16/00
Abstract:
A method of transferring heat from or to a workpiece support in an RF coupled plasma reactor includes placing coolant in an internal flow channel that is located inside the workpiece support and transferring heat from or to the coolant by circulating the coolant through a refrigeration loop in which the internal flow channel of the workpiece support constitutes an evaporator of the refrigeration loop. The method further includes maintaining thermal conditions of the coolant inside the evaporator within a range in which heat exchange between the workpiece support and the coolant is primarily or exclusively through the latent heat of vaporization of the coolant.
Public/Granted literature
- US20100300621A1 METHOD OF COOLING A WAFER SUPPORT AT A UNIFORM TEMPERATURE IN A CAPACITIVELY COUPLED PLASMA REACTOR Public/Granted day:2010-12-02
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