Invention Grant
- Patent Title: Semiconductor manufacturing equipment and manufacturing method of the same
- Patent Title (中): 半导体制造设备及制造方法相同
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Application No.: US12026425Application Date: 2008-02-05
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Publication No.: US08801895B2Publication Date: 2014-08-12
- Inventor: Hirotaka Inomata
- Applicant: Hirotaka Inomata
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion, LLC
- Current Assignee: Spansion, LLC
- Current Assignee Address: US CA Sunnyvale
- Priority: JP2007-025334 20070205
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/00 ; C23F1/08 ; C23C16/54 ; C23C16/44 ; H01L21/67
Abstract:
A semiconductor manufacturing equipment includes a first chamber that has a first connection hole, a second chamber that has a second connection hole connected to the first connection hole of the first chamber, an O-ring that is provided between the first chamber and the second chamber so as to surround the first connection hole and the second connection hole, and a cover portion that covers a space between the first chamber and the second chamber.
Public/Granted literature
- US20080210170A1 SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2008-09-04
Information query
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