Invention Grant
- Patent Title: Method of manufacturing molded object and molded object
- Patent Title (中): 制造模制物体和模制物体的方法
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Application No.: US13568882Application Date: 2012-08-07
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Publication No.: US08801986B2Publication Date: 2014-08-12
- Inventor: Takeshi Matsui , Nobuhiro Kihara , Junichi Kuzusako
- Applicant: Takeshi Matsui , Nobuhiro Kihara , Junichi Kuzusako
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2011-176608 20110812
- Main IPC: B29C67/00
- IPC: B29C67/00 ; G09B23/30

Abstract:
Disclosed is a method of manufacturing a molded object. The method includes: supplying a first liquid material to a first region out of a molding enabling region where a powder material is arranged and curing the powder material of the first region using a lamination molding technology to form a first insoluble part insoluble in a solvent; supplying a second liquid material different from the first liquid material to the powder material of a second region, which is provided so as to be surrounded by the first region, out of the molding enabling region and curing the powder material of the second region using the lamination molding technology to form a second soluble part soluble in the solvent; and dissolving the second part in the solvent.
Public/Granted literature
- US20130040110A1 METHOD OF MANUFACTURING MOLDED OBJECT AND MOLDED OBJECT Public/Granted day:2013-02-14
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