Invention Grant
US08801993B2 Polyurethane header formed directly on implantable electrical devices
有权
聚氨酯头部直接形成在可植入的电气设备上
- Patent Title: Polyurethane header formed directly on implantable electrical devices
- Patent Title (中): 聚氨酯头部直接形成在可植入的电气设备上
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Application No.: US13504589Application Date: 2010-10-22
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Publication No.: US08801993B2Publication Date: 2014-08-12
- Inventor: Ajay D. Padsalgikar , Elenora Stepanova , Richard Anup D'Mello , Jadwiga Weksler
- Applicant: Ajay D. Padsalgikar , Elenora Stepanova , Richard Anup D'Mello , Jadwiga Weksler
- Applicant Address: GB Weybridge Surrey
- Assignee: Aortech International plc
- Current Assignee: Aortech International plc
- Current Assignee Address: GB Weybridge Surrey
- Agency: Schwegman, Lundberg & Woessner, P.A.
- International Application: PCT/AU2010/001406 WO 20101022
- International Announcement: WO2011/050396 WO 20110505
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
This invention relates to electrical devices that are implantable inside an animal, including humans. The invention particularly relates to polyurethane headers mounted on the electrical devices to house electrical contacts. The polyurethane headers are formed by (a) mixing (i) a prepolymer comprising a silicon-containing diol of formula (I) in which R1, R2, R3 and R4 are independently selected from C1-6alkyl; R5 and R6 are independently selected from C1-6alkylene; R7 is C1-6alkylene, O, S or NR in which R is H or C1-6alkyl; and n is 1 to 3 and a diisocyanate; and (ii) a C2-12alkanediol; (b) injecting the mixture of the prepolymer and the C2-12alkanediol into a mold having a cavity shaped to form a header; (c) allowing the mixture to cure and form a polyurethane header within the mold; and (d) releasing the formed polyurethane header from the mold.
Public/Granted literature
- US20120271388A1 POLYURETHANE HEADER FORMED DIRECTLY ON IMPLANTABLE ELECTRICAL DEVICES Public/Granted day:2012-10-25
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