Invention Grant
- Patent Title: Fabrication method of flexible devices
- Patent Title (中): 柔性装置的制造方法
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Application No.: US13106124Application Date: 2011-06-14
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Publication No.: US08801997B2Publication Date: 2014-08-12
- Inventor: Byeong-Soo Bae , JungHo Jin
- Applicant: Byeong-Soo Bae , JungHo Jin
- Applicant Address: KR Daejeon
- Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee Address: KR Daejeon
- Agency: The Webb Law Firm
- Priority: KR10-2010-0089323 20100913
- Main IPC: B29C59/16
- IPC: B29C59/16 ; B29C33/42

Abstract:
Disclosed is a method of fabricating a flexible device, which includes surface-treating one or both sides of a carrier plate so that regions with different surface-treatments are formed on the same side of the carrier plate, forming a glass-filler reinforced plastic substrate film on the surface-treated carrier plate, forming thin film patterns on the glass-filler reinforced plastic substrate film, and separating the glass-filler reinforced plastic substrate film having the thin film patterns formed thereon from the carrier plate, and in which the surface-treating of the carrier plate enables the glass-filler reinforced plastic substrate film to be easily separated from the carrier plate without an additional process such as using a solvent or a laser release technique.
Public/Granted literature
- US20120061881A1 Fabrication Method of Flexible Devices Public/Granted day:2012-03-15
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