Invention Grant
- Patent Title: Clad plate
- Patent Title (中): 包层板
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Application No.: US13266817Application Date: 2010-01-08
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Publication No.: US08802242B2Publication Date: 2014-08-12
- Inventor: Yoshimitsu Oda , Masaaki Ishio , Toshiaki Fujita
- Applicant: Yoshimitsu Oda , Masaaki Ishio , Toshiaki Fujita
- Applicant Address: JP Osaka
- Assignee: Neomax Materials Co., Ltd.
- Current Assignee: Neomax Materials Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2009-129836 20090529
- International Application: PCT/JP2010/050144 WO 20100108
- International Announcement: WO2010/137353 WO 20101202
- Main IPC: B23K20/02
- IPC: B23K20/02 ; B23K35/30 ; C22C21/06 ; B32B15/01 ; C22C9/00 ; H01M2/30 ; C22C21/12 ; C22C21/02 ; C22C21/00 ; B23K33/00 ; C22C9/04 ; C22C19/00 ; C22C9/06 ; C22C38/00 ; C22C21/16 ; C22C19/03

Abstract:
A clad plate includes an aluminum plate and a hard metal plate joined together at side end surfaces thereof. Side end surfaces of an aluminum plate and a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably from about 0.2 mm to about 1.5 mm.
Public/Granted literature
- US20120058360A1 CLAD PLATE Public/Granted day:2012-03-08
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