Invention Grant
- Patent Title: Mixed mode ligands
- Patent Title (中): 混合模式配体
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Application No.: US13555484Application Date: 2012-07-23
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Publication No.: US08802448B2Publication Date: 2014-08-12
- Inventor: Hassan Ait-Haddou , Frank Onyemauwa , Jonathan Haigh , Samuel Nochumson
- Applicant: Hassan Ait-Haddou , Frank Onyemauwa , Jonathan Haigh , Samuel Nochumson
- Applicant Address: US NY Port Washington
- Assignee: Pall Corporation
- Current Assignee: Pall Corporation
- Current Assignee Address: US NY Port Washington
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: G01N33/547
- IPC: G01N33/547 ; G01N33/538 ; G01N33/53

Abstract:
Substrates comprising a solid support, a ligand, and a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, are disclosed, along with methods of using and making the substrates, and devices including the substrates.
Public/Granted literature
- US20130030154A1 MIXED MODE LIGANDS Public/Granted day:2013-01-31
Information query
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