Invention Grant
- Patent Title: Security-protection of a wafer of electronic circuits
- Patent Title (中): 电子电路晶片的安全保护
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Application No.: US13435201Application Date: 2012-03-30
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Publication No.: US08802455B2Publication Date: 2014-08-12
- Inventor: Francois Tailliet , Marc Battista , Luc Wuidart
- Applicant: Francois Tailliet , Marc Battista , Luc Wuidart
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: FR1152798 20110401
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A process is provided for fabricating a wafer including a plurality of chips separated by scribe lines. The method includes locking at least one chip on the wafer using a secret key, and writing the secret key into at least one memory present on the wafer.
Public/Granted literature
- US20120250429A1 SECURITY-PROTECTION OF A WAFER OF ELECTRONIC CIRCUITS Public/Granted day:2012-10-04
Information query
IPC分类:
