Invention Grant
- Patent Title: Circuit board mounting apparatus
- Patent Title (中): 电路板安装装置
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Application No.: US13446044Application Date: 2012-04-13
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Publication No.: US08802992B2Publication Date: 2014-08-12
- Inventor: Po-Wen Chiu , Wen-Hu Lu , Zhan-Yang Li
- Applicant: Po-Wen Chiu , Wen-Hu Lu , Zhan-Yang Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110239731 20110819
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K7/12 ; H05K7/14

Abstract:
A circuit board mounting apparatus comprises a chassis and a securing structure. The chassis comprises a bottom board and two sidewalls located on two opposite sides of the board. The securing structure comprises a reinforcing member and a securing member secured to the reinforcing member. The reinforcing member is secured to the bottom board. The securing member defines a securing hole. A fixing member extends through a through hole defined in the circuit board to engage in the securing hole, for preventing the circuit board from moving laterally.
Public/Granted literature
- US20130044449A1 CIRCUIT BOARD MOUNTING APPARATUS Public/Granted day:2013-02-21
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