Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US13456824Application Date: 2012-04-26
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Publication No.: US08802994B2Publication Date: 2014-08-12
- Inventor: Jun Ishii , Daisuke Yamauchi
- Applicant: Jun Ishii , Daisuke Yamauchi
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2011-103608 20110506
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/00 ; H05K1/11
Abstract:
An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.
Public/Granted literature
- US20120279757A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-11-08
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