There is provided a device for surface mounting that has a substrate and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate and the capacitor element using a packaging resin. The substrate includes a first terminal electrode electrically connected to a first electrode of the capacitor element and a second terminal electrode electrically connected to a second electrode of the capacitor element, at least part of a mounting-side surface on an opposite side to the loading-side surface of the substrate is exposed on a mounting surface of the device, and the first terminal electrode and the second terminal electrode are adjacently disposed around an entire circumference of the mounting surface of the device.