Invention Grant
- Patent Title: Multi-wiring layer solid-state imaging device with increased sensitivity, electronic apparatus, and method for manufacturing same
- Patent Title (中): 具有增加灵敏度的多层布线层固态成像装置，电子设备及其制造方法
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Application No.: US13867808Application Date: 2013-04-22
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Publication No.: US08803067B2Publication Date: 2014-08-12
- Inventor: Kyohei Mizuta , Kazuichiro Itonaga
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-115843 20090512
- Main IPC: H01L31/00
- IPC: H01L31/00
Abstract:
A solid state imaging device is described that includes a semiconductor substrate having a plurality of photodiodes thereon. The solid state imaging device further includes a first wiring portion, a second wiring portion and a third wiring portion. The device further includes a first wiring layer over the semiconductor substrate and which includes a plurality of metal films and extends across all the wiring portions. Additionally, a second wiring layer is disposed over the first wiring layer and which extends across the first wiring portion and the second wiring portion.
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