Invention Grant
US08803131B2 Metal-free integrated circuits comprising graphene and carbon nanotubes
有权
包含石墨烯和碳纳米管的无金属集成电路
- Patent Title: Metal-free integrated circuits comprising graphene and carbon nanotubes
- Patent Title (中): 包含石墨烯和碳纳米管的无金属集成电路
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Application No.: US13604254Application Date: 2012-09-05
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Publication No.: US08803131B2Publication Date: 2014-08-12
- Inventor: Yu-Ming Lin , Jeng-Bang Yau
- Applicant: Yu-Ming Lin , Jeng-Bang Yau
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
An integrated circuit includes a graphene layer, the graphene layer comprising a region of undoped graphene, the undoped graphene comprising a channel of a transistor, and a region of doped graphene, the doped graphene comprising a contact of the transistor; and a gate of the transistor, the gate comprising a carbon nanotube film. A method of fabricating an integrated circuit comprising graphene and carbon nanotubes, includes forming a graphene layer; doping a portion of the graphene layer, resulting in doped graphene and undoped graphene; forming a carbon nanotube film; and etching the carbon nanotube film to form a gate of a transistor, wherein the transistor further comprises a channel comprising the undoped graphene and a contact comprising the doped graphene. A transistor includes a gate, the gate comprising a carbon nanotube film; a channel, the channel comprising undoped graphene; and a contact, the contact comprising doped graphene.
Public/Granted literature
- US20120326129A1 METAL-FREE INTEGRATED CIRCUITS COMPRISING GRAPHENE AND CARBON NANOTUBES Public/Granted day:2012-12-27
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