Invention Grant
- Patent Title: Light-emitting module, light-emitting device, method of manufacturing the light-emitting module, and method of manufacturing the light-emitting device
- Patent Title (中): 发光模块，发光装置，发光模块的制造方法以及发光装置的制造方法
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Application No.: US13592722Application Date: 2012-08-23
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Publication No.: US08803136B2Publication Date: 2014-08-12
- Inventor: Shunpei Yamazaki , Kaoru Hatano , Satoshi Seo , Akihiro Chida
- Applicant: Shunpei Yamazaki , Kaoru Hatano , Satoshi Seo , Akihiro Chida
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2011-184869 20110826
- Main IPC: H01L51/50
- IPC: H01L51/50 ; H01L29/51
Abstract:
A highly reliable light-emitting module including an organic EL element or a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. Alternatively, a method of manufacturing a highly reliable light-emitting module including an organic EL element, or a method of manufacturing a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. The light-emitting module has a structure in which a light-emitting element formed over a first substrate and a viscous material layer are sealed in a space between the first substrate and a second substrate which face each other, with a sealing material surrounding the light-emitting element. The viscous material layer is provided between the light-emitting element and the second substrate and includes a non-solid material and a drying agent which reacts with or adsorbs an impurity.
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