Invention Grant
- Patent Title: Structure of AC light-emitting diode dies
- Patent Title (中): 交流发光二极管管芯的结构
-
Application No.: US12861495Application Date: 2010-08-23
-
Publication No.: US08803166B2Publication Date: 2014-08-12
- Inventor: Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
- Applicant: Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW93126201A 20040831
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.
Public/Granted literature
- US20110012137A1 STRUCTURE OF AC LIGHT-EMITTING DIODE DIES Public/Granted day:2011-01-20
Information query
IPC分类:
