Invention Grant
US08803181B2 Semiconductor light emitting device and fabrication method of the semiconductor light emitting device 有权
半导体发光器件及半导体发光器件的制造方法

  • Patent Title: Semiconductor light emitting device and fabrication method of the semiconductor light emitting device
  • Patent Title (中): 半导体发光器件及半导体发光器件的制造方法
  • Application No.: US12285702
    Application Date: 2008-10-10
  • Publication No.: US08803181B2
    Publication Date: 2014-08-12
  • Inventor: Masakazu TakaoKazuhiko Senda
  • Applicant: Masakazu TakaoKazuhiko Senda
  • Applicant Address: JP Kyoto-Shi, Kyoto-Fu
  • Assignee: Rohm Co., Ltd.
  • Current Assignee: Rohm Co., Ltd.
  • Current Assignee Address: JP Kyoto-Shi, Kyoto-Fu
  • Agency: Rabin & Berdo, P.C.
  • Priority: JPP2007-265763 20071011
  • Main IPC: H01L33/38
  • IPC: H01L33/38
Semiconductor light emitting device and fabrication method of the semiconductor light emitting device
Abstract:
A semiconductor light emitting device which can control of current density and can optimize current density and in which a rise in luminosity is possible, and a fabrication method of the semiconductor light emitting device are provided. The semiconductor light emitting device including: a semiconductor substrate structure including a semiconductor substrate, a first metal layer placed on a first surface of the semiconductor substrate, and a second metal layer placed on a second surface of the semiconductor substrate; and a light emitting diode structure including a third metal layer placed on the semiconductor substrate structure, a current control layer placed on the third metal layer and composed of a transparent insulating film and a current control electrode, an epitaxial growth layer placed on the current control layer, and a surface electrode placed on the epitaxial growth layer, wherein the semiconductor substrate structure and the light emitting diode structure are bonded by using the first metal layer and the third metal layer.
Information query
Patent Agency Ranking
0/0