Invention Grant
US08803219B2 Nonvolatile semiconductor memory device and method of manufacturing
有权
非易失性半导体存储器件及其制造方法
- Patent Title: Nonvolatile semiconductor memory device and method of manufacturing
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US13748101Application Date: 2013-01-23
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Publication No.: US08803219B2Publication Date: 2014-08-12
- Inventor: Motoyuki Sato
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2012-139021 20120620
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, and a charge trap layer on the interface insulating layer, and a lower end of a conduction band of the interface insulating layer is higher than a trap level of the charge trap layer and is lower than a lower end of a conduction band of the charge trap layer.
Public/Granted literature
- US20130341698A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING Public/Granted day:2013-12-26
Information query
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