Invention Grant
- Patent Title: High voltage semiconductor device and method for fabricating the same
- Patent Title (中): 高压半导体器件及其制造方法
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Application No.: US13846657Application Date: 2013-03-18
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Publication No.: US08803234B1Publication Date: 2014-08-12
- Inventor: Chih-Cherng Liao , Yun-Chou Wei , Pi-Kuang Chuang , Ching-Yi Hsu , Chih-Wei Lin , Wen-Chung Chen , Che-Hua Chang , Yung-Lung Chou , Chung-Te Chou , Cheng-Lun Cho , Ya-Han Liang
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/4763 ; H01L29/423 ; H01L29/78

Abstract:
A high voltage (HV) semiconductor device includes: a semiconductor substrate having a first conductivity type; a gate structure disposed over a portion of the semiconductor substrate; a pair of spacers respectively disposed over a sidewall of the gate structure, wherein one of the spacers is a composite spacer comprising a first insulating spacer contacting the gate structure, a dummy gate structure, and a second insulating spacer; a first drift region disposed in a portion of the semiconductor, underlying a portion of the gate structure and one of the pair of spacers, having a second conductivity type opposite to the first conductivity type; and a pair of doping regions, respectively disposed in a portion of the semiconductor substrate on opposite sides of the gate structure, wherein the pair of doping regions include the second conductivity type and one of the doping regions is disposed in the first drift region.
Information query
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