Invention Grant
- Patent Title: High temperature operating package and circuit design
- Patent Title (中): 高温运行封装和电路设计
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Application No.: US13221179Application Date: 2011-08-30
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Publication No.: US08803239B2Publication Date: 2014-08-12
- Inventor: Neill Thornton , Dennis Lang
- Applicant: Neill Thornton , Dennis Lang
- Applicant Address: US CA San Jose
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/11 ; H01L21/02 ; H01L29/417 ; H01L29/45
Abstract:
The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
Public/Granted literature
- US20120032712A1 HIGH TEMPERATURE OPERATING PACKAGE AND CIRCUIT DESIGN Public/Granted day:2012-02-09
Information query
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