Invention Grant
- Patent Title: High-frequency module and communication apparatus
- Patent Title (中): 高频模块和通讯设备
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Application No.: US13753370Application Date: 2013-01-29
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Publication No.: US08803315B2Publication Date: 2014-08-12
- Inventor: Koichi Takizawa , Yoshihiko Goto , Kaoru Sudo , Hirotaka Fujii
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2010-170322 20100729
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals.
Public/Granted literature
- US20140138804A1 HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2014-05-22
Information query
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