Invention Grant
- Patent Title: Package structures and methods for forming the same
- Patent Title (中): 包装结构及其形成方法
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Application No.: US13539048Application Date: 2012-06-29
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Publication No.: US08803323B2Publication Date: 2014-08-12
- Inventor: Chen-Hua Yu , Jiun Yi Wu , Tsung-Ding Wang
- Applicant: Chen-Hua Yu , Jiun Yi Wu , Tsung-Ding Wang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
A device includes a first package component and the second package component. The first package component includes a first plurality of connectors at a top surface of the first package component, and a second plurality of connectors at the top surface. The second package component is over and bonded to the first plurality of connectors, wherein the second plurality of connectors is not bonded to the second package component. A solder resist is on the top surface of the first package component. A trench is disposed in the solder resist, wherein a portion of the trench spaces the second plurality of connectors apart from the first plurality of connectors.
Public/Granted literature
- US20140001644A1 Package Structures and Methods for Forming the Same Public/Granted day:2014-01-02
Information query
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