Invention Grant
- Patent Title: Wafer level camera module with snap-in latch
- Patent Title (中): 晶圆级摄像机模块,带有卡入式闩锁
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Application No.: US13435596Application Date: 2012-03-30
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Publication No.: US08804032B2Publication Date: 2014-08-12
- Inventor: Kevin Ka Kei Leung , Wen Hua Lin
- Applicant: Kevin Ka Kei Leung , Wen Hua Lin
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B17/02

Abstract:
An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. The protective tube includes an outer wall having a snap-in latch element disposed thereon. A metal housing encloses the protective tube. The metal housing includes a housing foot and inner wall having an opposite snap-in latch element disposed thereon. The image sensor module is adapted to be secured between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube.
Public/Granted literature
- US20130258181A1 WAFER LEVEL CAMERA MODULE WITH SNAP-IN LATCH Public/Granted day:2013-10-03
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