Invention Grant
- Patent Title: Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other
- Patent Title (中): 一种显示装置的制造方法,包括:将第二基板和半导体芯片同时研磨成具有相同厚度的步骤
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Application No.: US13588620Application Date: 2012-08-17
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Publication No.: US08804089B2Publication Date: 2014-08-12
- Inventor: Masumitsu Ino
- Applicant: Masumitsu Ino
- Applicant Address: JP Aichi
- Assignee: Japan Display West Inc.
- Current Assignee: Japan Display West Inc.
- Current Assignee Address: JP Aichi
- Agency: Dentons US LLP
- Priority: JP2006-069539 20060314
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; G02F1/13

Abstract:
A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.
Public/Granted literature
- US20120314162A1 DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2012-12-13
Information query
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