Invention Grant
US08804089B2 Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other 有权
一种显示装置的制造方法,包括:将第二基板和半导体芯片同时研磨成具有相同厚度的步骤

  • Patent Title: Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other
  • Patent Title (中): 一种显示装置的制造方法,包括:将第二基板和半导体芯片同时研磨成具有相同厚度的步骤
  • Application No.: US13588620
    Application Date: 2012-08-17
  • Publication No.: US08804089B2
    Publication Date: 2014-08-12
  • Inventor: Masumitsu Ino
  • Applicant: Masumitsu Ino
  • Applicant Address: JP Aichi
  • Assignee: Japan Display West Inc.
  • Current Assignee: Japan Display West Inc.
  • Current Assignee Address: JP Aichi
  • Agency: Dentons US LLP
  • Priority: JP2006-069539 20060314
  • Main IPC: G02F1/1345
  • IPC: G02F1/1345 G02F1/13
Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other
Abstract:
A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.
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