In a method for inspecting a conductor crimping portion of a crimping terminal, a laser displacement meter is disposed on a final stage of the terminal manufacturing line, and an upper surface of the flat-shaped bottom plate of the conductor crimping portion of a conveyed crimping terminal is measured, thereby acquiring, as an inspection result, data pertaining to at least one of items; namely, a width of the interior surface of a bottom plate, a width of the serrations, and a depth of the serrations.