Invention Grant
- Patent Title: Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capability
- Patent Title (中): 确定临界尺寸均匀性和掩模版配合晶圆覆盖能力的独特标记和方法
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Application No.: US12819281Application Date: 2010-06-21
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Publication No.: US08804137B2Publication Date: 2014-08-12
- Inventor: DongSub Choi , Amir Widmann , Zain Saidin , Frank Laske , John Robinson
- Applicant: DongSub Choi , Amir Widmann , Zain Saidin , Frank Laske , John Robinson
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B11/14
- IPC: G01B11/14
Abstract:
A combined metrology mark, a system, and a method for calculating alignment on a semiconductor circuit are disclosed. The combined metrology mark may include a mask misregistration structure and a wafer overlay mark structure.
Public/Granted literature
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