Invention Grant
- Patent Title: Swage coupling assembly
- Patent Title (中): 金属联轴器组件
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Application No.: US13790609Application Date: 2013-03-08
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Publication No.: US08804286B1Publication Date: 2014-08-12
- Inventor: Prapan Aparimarn , Joompondej Bamrungwongtaree
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Westman, Champlin & Koehler, P.A.
- Agent Leanne Taveggia Farrell
- Main IPC: G11B5/48
- IPC: G11B5/48 ; G11B21/16

Abstract:
A mount plate includes a flange having a first surface and an opposing second surface and a boss tower having a swage hole and extending from an area where the boss tower meets the first surface of the flange to an end surface of the boss tower. The boss tower has an inner diameter defining an inner surface of the swage hole, an outer diameter defining a portion of an outer surface of the boss tower and at least one cut-out portion formed in the boss tower along an obliquely angled plane. The cut-out portion intersects with the outer surface at a first area located a first distance from where the boss tower meets the first surface of the flange and intersects with the end surface at a second area located a second distance from the inner diameter. The first distance is less than the second distance.
Information query
IPC分类: