Invention Grant
- Patent Title: Computer system including a heat dissipating apparatus
- Patent Title (中): 包括散热装置在内的计算机系统
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Application No.: US13172292Application Date: 2011-06-29
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Publication No.: US08804329B2Publication Date: 2014-08-12
- Inventor: Yang Li
- Applicant: Yang Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201010531879 20101104
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display. A motherboard is attached to the housing, and a fan module. The motherboard includes a heat generating component. A first input opening and an output opening is defined in the cover. The output opening corresponds to the fan module. The air duct is mounted on the heat generating component. A plurality first holes are defined in the air duct corresponding to the heat generating component. The air duct corresponds to the first input opening to guide air to flow to the heat generating component via the first input opening and the plurality of first holes.
Public/Granted literature
- US20120113580A1 COMPUTER SYSTEM Public/Granted day:2012-05-10
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