Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US13404074Application Date: 2012-02-24
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Publication No.: US08804335B2Publication Date: 2014-08-12
- Inventor: Yun-Lung Chen , Chung Chai , Wei-Yong Ma
- Applicant: Yun-Lung Chen , Chung Chai , Wei-Yong Ma
- Applicant Address: CN Wuhan TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Wuhan TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110147631 20110602
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
The electronic device enclosure includes a case and a cooling assembly. The case includes a top plate, a bottom plate, a side plate and a mounting plate. The top plate is opposite to the bottom plate, and the side plate is substantially perpendicularly connected to the top plate and the bottom plate. The cooling assembly includes a cooler and a fan secured to the cooler. The mounting plate is secured to the top plate and the bottom plate, the fan is secured to the mounting plate and located between the mounting plate and the cooler.
Public/Granted literature
- US20120307450A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2012-12-06
Information query
