Invention Grant
- Patent Title: Structural assembly for cold plate cooling
- Patent Title (中): 冷板冷却结构装配
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Application No.: US13429691Application Date: 2012-03-26
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Publication No.: US08804337B2Publication Date: 2014-08-12
- Inventor: Mark A. Zaffetti , Edmund P. Taddey
- Applicant: Mark A. Zaffetti , Edmund P. Taddey
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrand Space Systems International, Inc.
- Current Assignee: Hamilton Sundstrand Space Systems International, Inc.
- Current Assignee Address: US CT Windsor Locks
- Agency: Cantor Colburn LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A device including a structural member having a heat spreader and an electronic device mounted directly to a first surface of the heat spreader of the structural member. The device also includes a cold plate mounted directly to the first surface of the heat spreader of the structural member.
Public/Granted literature
- US20130250519A1 Structural Assembly for Cold Plate Cooling Public/Granted day:2013-09-26
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