Invention Grant
- Patent Title: Heat pipe docking system
- Patent Title (中): 热管对接系统
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Application No.: US13496702Application Date: 2010-09-17
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Publication No.: US08804338B2Publication Date: 2014-08-12
- Inventor: Hideo Nagasawa
- Applicant: Hideo Nagasawa
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- Priority: JP2009-215727 20090917
- International Application: PCT/US2010/049303 WO 20100917
- International Announcement: WO2011/035137 WO 20110324
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
To provide electronic equipment having a heat discharging function capable of achieving the maximum in the signal processing capability of a portable terminal by preventing the functional restriction of the portable terminal by effectively discharging exothermic heat from the portable terminal at the time of coupling the portable terminal whose function is restricted by heat generation to an external device, as well as a heat discharging system and a heat discharging method.
Public/Granted literature
- US20120236501A1 HEAT PIPE DOCKING SYSTEM Public/Granted day:2012-09-20
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