Invention Grant
- Patent Title: Mounting apparatus for expansion card
- Patent Title (中): 扩充卡安装装置
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Application No.: US13411905Application Date: 2012-03-05
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Publication No.: US08804356B2Publication Date: 2014-08-12
- Inventor: Lung-Sheng Tsai , Yao-Chung Chen
- Applicant: Lung-Sheng Tsai , Yao-Chung Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW100120785A 20110614
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A mounting apparatus for an expansion card includes a bottom plate, a circuit board, and mounting bracket. The bottom plate defines mounting hole. The circuit board is secured to the bottom plate, and a gap is defined between the bottom plate and the circuit board. The mounting bracket includes a base secured to the bottom plate. The base includes two positioning pieces and an elastically deformable mounting portion. The two positioning pieces are received in the gap, to prevent the mounting bracket from moving along a first direction substantially perpendicular to the bottom plate, and the elastically deformable mounting portion is engaged in the mounting hole, to prevent the mounting bracket from moving along a second direction substantially parallel to the bottom plate.
Public/Granted literature
- US20120320547A1 MOUNTING APPARATUS FOR EXPANSION CARD Public/Granted day:2012-12-20
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